At CES 2025, Intel said it plans to ship additional Arrow Lake desktop chips this month, alongside two new desktop chips that have already begun to surface in motherboards for desktop PCs.
Intel introduced the world to the desktop version of Arrow Lake in October 2024, with five Core Ultra 200S chips, many featuring the “K” suffix that signals that they can be overclocked. Eventually, Intel plans to ship about 30 Core Ultra 200S chips, executives said at CES.
For now, however, Intel is highlighting three, which are all slated to ship later in January 2025:
- Intel Core Ultra 9 285: 8 P Cores, 16 E Cores (24 threads), up to 5.6GHz, 65W
- Intel Core Ultra 7 265: 8 P Cores, 12 E Cores (24 threads), up to 5.3 GHz, 65W
- Intel Core Ultra 5 245: 6 P Cores, 8 E Cores (14 threads), up to 5.1GHz, 65W
![Intel Arrow Lake B860 chipset](https://b2c-contenthub.com/wp-content/uploads/2025/01/20250106_094018.jpg?quality=50&strip=all&w=1200)
Mark Hachman / IDG
Intel is also launching a pair of new desktop chipsets, company executives said: the B860 and the H810.
The B860 chipset, presumably the more full-featured and expensive of the two, includes a more robust feature set that includes 14 PCIe 4 lanes (and an unknown number of PCIe 5 lanes), 12 USB 2.0 connections, and 6 USB 3.2 connections, with Wi-Fi 6 and Bluetooth 5.3. The chipset will support DDR5 6400 memory and will include support for HDMI 2.1, DisplayPort 2.1, and Thunderbolt 4.
![Intel Arrow Lake H810 chipset](https://b2c-contenthub.com/wp-content/uploads/2025/01/20250106_094038.jpg?quality=50&strip=all&w=1200)
Mark Hachman / IDG
The H810 chipset, on the other hand, is cut down to 8 PCIe 4 lanes and 16 PCIe 5 lanes, with just 10 USB 2.0 connections and 4 USB 3.2 connections. It will also support DDR5 6400 memory, HDMI 2.1, and Thunderbolt 4.
Intel has begun posting some of the specifications of the B860 and H810.
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