Features High density high impedancePure alloy compositinFine and stickyStannum planting not bubbingSilver containing highlight Model SP XWeight 50gSize 38 x 31 x 35mmMelting Point 158℃Package Included 1 x SP X Middle Layer of BGA Motherboard Special Solder Paste Detail Pictures
Price history
Apr 18, 2022
€12.01